SHINKO SEIKI'S FINE ELECTRIC FURNACES AND SEMICONDUCTOR THIN FILM PROCESSING SYSTEM

H2 (N2) Atmosphere Conveyor Furnace

This conveyor furnace is for the treatment of electronic components in their soldering, brazing, sealing, and alloying process. The furnace is designed so that it can constantly maintain a stable H2 (N2) atmospheric condition assuring safety against H2 gas.

Specifications of H2 (N2) Atmosphere Conveyor Furnace (Enlarged View)

Model Conveyer Atmosphere Heater Section Electric Power Dimensions
L X W X H(mm)
Width (mm) Speed (mm/mm)
FC-310-NH 100 30 H2 5 12 3500 X 700 X 1500
FC-320-NH 200 30 H2 5 17 3500 X 700 X 1500
FC-1030-NH 300 100

H2

 7 31 7400 X 900 X 1600
FC-8040-NH 400 80 H2 6 40 5500 X 1150 X 1600
 

Vacuum/H2 Atmosphere Soldering Furnace

This furnace has enabled to realize no flux and voidless soldering treatment for high current devices and for bump forming on wafers and substrates.

The furnace is the results of SHINKO SEIKI's technological combination in the field of vacuum/H2 atmosphere and rapid heating/cooling.

Specifications of Vacuum / H2 Atmosphere Soldering Furnace (Enlarged View)

Subjects of Treatment and Process

 Soldering of electronic components and bump forming on wafer

Treating Space

W 300 mm X D 300 mm X H 60 mm

Treating Temperature
Working Temperature 100 - 400°C Max 450°C (Constant temperature: W 300 mm X D 300 mm 320°C ± 5°C)
Time Required for Temperature Up Within 5 minutes from room temperature to 350°C (hot plate direct heating system)
Time Required for Temperature Down Within 4 minutes from 350 to 100°C (water cooling system)
Above figures were measured on carbon jigs (200 W X 200 D X 20 H mm)

Atmosphere

N2, H2, or vacuum atmosphere (with slow exhaust functions)

Vacuum Pumping System Oil - sealed rotary vacuum pump (ultimate vacuum 10-1 Pa order
Gas N2, H2

Above figures are under no load and room temperature.
Operation

Manual/Automatic (attached with the program controller)
Optional Items O2 density meter, Dewpoint meter, H2 detector
 

Down Flow Ashing System

This ashing system (SMASH) is provided with the two microwave down-flow ashing processing chambers designed by SHINKO SEIKI for resist stripping in VLSI production process. The system features low damage, high throughput resist strippings.

SHINKO SEIKI also manufactures the resist stripping system (DREAM) which is solely for the resist transformed by high density ion implantation.

Layout of chambers (DREAM)

Layout of chambers (SMASH)
 
Dry Processing System for Optical Disk (POEM)

In recent years, it has been tried to transform the quality of stamper surface to improve the productivity of optical disks. SHINKO SEIKI has developed

"POEM", which is a dry processing system for optical disks, for the purpose of resist stripping on stamper surface and for the transformation of its surface utilizing SHINKO SEIKI's own technology which has been established in semi-conductor field. This system is the first in the world as a dry processing system designed specially for optical disks.

Specifications (Enlarged View)

Usage

 For photo resist stripping of optical disk stamper
Features
  • Complete removal of photo resist which is unable to remove fully by chemical washing.
  • Improvement of quality and productivity of optical disks through increase of stripping performance
Process High frequency plasma treatment
Dimensions of the system (mm)
Main unit 550 (Width) X 1,050 (Depth) X 920 (Height)
Pumping System 490 (Width) X 730 (Depth) X 740 (Height)

Weight (kg)

Main unit 150
Pumping system 130
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