Vacuum/H2 Atmosphere Soldering Furnace

Subjects of Treatment and Process Soldering of electronic components and bump forming on wafer

Treating Space

W 300 mm X D 300 mm X H 60 mm

Treating Temperature
Working Temperature 100 - 400°C Max 450°C (Constant temperature: W 300 mm X D 300 mm 320°C ± 5°C)
Time Required for Temperature Up Within 5 minutes from room temperature to 350°C (hot plate direct heating system)
Time Required for Temperature Down Within 4 minutes from 350 to 100°C (water cooling system)
Above figures were measured on carbon jigs (200 W X 200 D X 20 H mm)

Atmosphere

N2, H2, or vacuum atmosphere (with slow exhaust functions)
Vacuum Pumping System Oil - sealed rotary vacuum pump (ultimate vacuum 10-1 Pa order
Gas N2, H2

Above figures are under no load and room temperature.
Operation

Manual/Automatic (attached with the program controller)
Optional Items O2 density meter, Dewpoint meter, H2 detector

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