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Products·Features |
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♦Vacuum reflow system |
Realizes non- flux and voidless soldering.
Batch type / Inline type |
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♦Plasma reflow system |
Reduces oxides in the solder by irradiating hydrogen radicals having generated in H2 plasma. |
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♦Special assembling equipment |
| Single wafer processing thermal treatment system with quick heating and quick cooling
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