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| ♦Vacuum reflow system | |||
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| Vacuum reflow system | |
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[Feature 1] Provides quick heating and quick cooling processing works through direct heating by hot plate and special cooling mechanism so that optimal reflow conditions will be achieved. |
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| [Feature 2] Reduces oxides of solder sheet and pad non-flux processing, with the whole stroke maintained in a H2 reduction atmosphere or anti-oxidation atmosphere to ensure excellent wettability. |
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| [Feature 3] Eliminates voids by performing deaeration in vacuum during the process of solder melting. |