SHINKO SEIKI CO.,LTD.

♦Etching & ashing equipment

Plasma etching system, EXAM

Turbo-furnished EXAM

Simply switch between hard mode and soft mode, and anisotropic and isotropic etching will be achieved.
The user can perform etching in a wide pressure range because a wide-range turbo pump is used.
This system also allows a wide range of control over RF power, electrode gap, gas flow and other factors.
It is suitable to research and development as well as small-lot production.
[Options]
Load-lock chamber
Cassette-to-cassette transfer

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Downflow & 2-step ashing system

DREAM & CHAMP

This is a 2-step ashing system (DREAM) for peeling resist after high-dose ion in-plant, consisting of a combination of a low-damage high-throughput ashing unit (CHAMP) by means of microwave downflow system, and a microwave downflow chamber and an RIE chamber.

♦Downflow ashing system
This system completely traps microwave-generated ions and electrons in the plasma, leads only radicals to the surface of wafer on the stage, and then ash them, thus preventing damage by charge up.

♦2-step ashing
This epoch-making method uses 2-step treatment to ash the resist, which were damaged by high-dose ion injection and other reasons, without leaving any residue.

1. First step
The surface of damaged resist has turned into a degenerated hard layer. First, a unique method removes this degenerated layer.
2. Second step
The resist remaining after removal of degenerated hard layer from the surface is treated by high-speed ashing of the downflow system.

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