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| ♦Vapor deposition system |
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| AAMF-C
series (for wafer processing) |
| This system is provided
with six throws of electron gun and four pairs of resistance heating
evaporation source, allowing treatment of combination of multilayer-film
vapor deposition and simultaneous binary vapor deposition in a full-automatic
process! Furthermore, substrates can be heated up to 500°C so that
alloying operation is available. Long-running and best-selling machines
of this series are supported by abundance of track records. |
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| Model : AAMF-C1650SPBR |
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[Features]
This machine is provided with six throws of electron gun and three
rows of resistance evaporation source, allowing vapor deposition in
high vacuum of 10-6Pa. Adoption of the special substrates cooling
mechanism can keep the substrates temperature at 50°C or lower when
gold is vapor-deposited to the thickness of 500nm.
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