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| ♦Sputtering equipment |
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| Load-lock
sputtering system |
Space saving has been achieved
in this load-lock sputtering machine. Twelve trays of maximum φ270
can be set for standard in the cassette chamber, enabling continuous
sputtering operation.
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[Features]
Because of the three φ100mm cathodes incorporated in the machine,
the user can form multilayer films and achieve film thickness distribution
of ±5% or less in the area of φ250mm.
Since vacuum is normally maintained in the transfer chamber and the
film deposition chamber, this space-saving, load-lock sputtering unit
can shorten the processing time.
The adoption of touch panel enables real-time process monitoring.
In addition, data logging is also available on an optional personal
computer. |
| Multi-chamber
sputtering system |
| A submicron process, which
carves out next-generation devices, is assured by this multi-chamber
sputtering system! |
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[Features]
- The system has the ability to process wafer substrates (76.2
- 203.2mm) as well as glass or ceramic plates sized maximum 203mm
diagonally.
- Provides a substantial set of selecting functions to support
basic research for future process and production of diversified
prototypes.
- Reliability-oriented components are incorporated in a standard
unit.
- Shorter operation hours and rise time have been achieved by
the adoption of independent chamber maintenance and simplified
maintenance method.
- Space saving and through-wall structure ensure proper use of
clean room at high level.
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