Ultra-high vacuum sputtering system
The STM2323 is a single wafer sputtering system applicable to ultra-high vacuums. It provides exhaust performance of 10-7 Pa background pressure in the sputtering chamber. T
he system is comprised of a load-lock chamber, cassette chamber, transfer chamber and sputtering chambers (6 chambers in total), thus enabling forming of multiple types of film and through processing under ultra-high vacuum. This system is particularly effective for developing magnetic devices and compounds.
This latest multi-chamber system is applicable with wafers up to 8 inch in diameter.
It is intended for research and development of cutting-edge devices (magnetic devices, nitride semiconductors, oxide semiconductors, etc.)