Load-lock type sputtering system
This load-lock type sputtering system features space-saving design.
12 trays (φ270 max.) can be stored in the standard cassette chamber, enabling continuous sputtering.
- This system uses three cathodes (φ100 mm), thus is capable of forming multiple films.
- Film thickness distribution is φ250 mm ±10%.
- Because the transfer chamber and film forming chamber are always kept under vacuum, throughput time can be shortened.
- This space-saving load-lock type sputtering unit enables real-time process verification from the touch panel.