Plasma reflow unit
In forming solder bumps on wafers, this unit supplies hydrogen radicals generated by hydrogen plasma to wafer surfaces to remove oxide films from solder layers without using flux.
It eliminates the need for flux cleaning processes. Since the solder bump is melted under reduced pressure, voids are removed by the vacuum degassing effect.
- This unit makes the wafer bump reflow process completely dry.
- This unit both enables flux-free processing and eliminates voids .
- New reflow process proposed by SHINKO SEIKI