Vacuum Sintering System
This system supports advance packaging and next-generation bonding applications. It is designed for multipurpose
sintering processes, including sinter bonding and via firing, and accommodates workpieces up to 615 mm × 510 mm,
matching the requirements of advance package processes.
System appearance Basic Specifications
Applications
- Solder bonding for power devices (IGBT / IPM)
- Soldering of various electronic components
- Sintering processes
- Including TGV substrates
- De-gassing and annealing processes
Note: Specifications and options can be customized according to process requirements.
