We will be exhibiting various products for power devices and next-generation packaging at
the 40th NEPCON JAPAN – Electronics Development and Packaging Exhibition.

 

 

■Venue/Dates: Tokyo Big Sight/January 21st-23rd, 2026
■Booth Location: East Hall 4, E3-39
■Exhibited Products
　① Vacuum Soldering Equipment (Vacuum Reflow Equipment)
　　Our company holds the No. 1 track record in Japan, and we have developed a new
　　equipment for next-generation packaging that is compatible with 600mm square substrates.
　　While accommodating large substrates, it achieves high thermal uniformity and, like our
　　previous equipment, is compatible with various reducing atmospheres.

　② Vacuum Plasma Equipment
　　Our standard lineup includes a processing stage that supports substrates up to 600mm
　　square.
　　We also offer automated equipment for FOUPs.

　③ Atmospheric Pressure Plasma System [Demo Model]
　　This system uses Ar ions to perform highly efficient and stable surface modification even at
　　atmospheric pressure.
　　It can also be used to improve solder wettability and clean lead frame substrates, allowing us
　　to propose systems tailored to various substrates.

　　Leveraging the extensive experience in vacuum and heat treatment technologies we have
　　built up over the 77 years since our founding, we continue to take on new fields and technologies.
　　All of our employees look forward to your visit.