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Information on launching a new product (New batch type vacuum soldering equipment)

Information

We are pleased to inform Shinko Seiki is launching a new batch type vacuum soldering equipment.
The new type equipment adopts new type heat plate, which enables larger soaking dimensions and
process capacity compared to a conventional equipment. In addition, the equipment cut down speed
of temperature rising・falling significantly, that gives you improved throughput.
Additionally, since the new equipment improves maximum heating temperature and soaking
performance at high temperature, it has capability of handling wider process ranges for sinter bonding
of various types of metal Nano paste.

The new type vacuum soldering equipment to be launched newly is being displayed in The 34th
NEPCON JAPAN -R&D and Manufacturing- held at Tokyo Big Sight starting on Jan. 15th 2020.(Wed.)  

We will start evaluation tests requested by customers at the Kobe factory of Shinko Seiki after the
exhibition. We are looking forward to your request for evaluation of the equipment.

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