Load-lock type sputtering system

This load-lock type sputtering system features space-saving design.
12 trays (φ270 max.) can be stored in the standard cassette chamber, enabling continuous sputtering.

Model: STL5321


  • This system uses three cathodes (φ100 mm), thus is capable of forming multiple films.
  • Film thickness distribution is φ250 mm ±10%.
  • Because the transfer chamber and film forming chamber are always kept under vacuum, throughput time can be shortened.
  • This space-saving load-lock type sputtering unit enables real-time process verification from the touch panel.

Equipment specifications

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